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Call for papers for the Sensors – Special Issue on Full-Duplex Wireless Communications

30 November 2021

Sensors – Special Issue on Full-Duplex Wireless Communications

To meet the rising demand for high-speed data services, wireless networks must exploit the available frequency spectrum more efficiently. One key limit to spectrum utilization efficiency involves the current practice of half-duplex communication, in which a node either transmits or receives a signal in a single-channel usage. This separation prevents self-interference, which has frequently been seen as an insurmountable technical problem. Promoted by the popularity of small-cell wireless systems, recent works have provided experimental evidence and methodologies for full-duplex communication, in which a node transmits and receives signals at the same time and on the same frequency band. Full-duplex communications have the potential to improve the attainable spectral efficiency and throughput and reduce latency.

This Special Issue will provide a synthesized source of recent research results and to serve as a springboard for future work in Full-Duplex Wireless Communications. The possible topics include, but are not limited to the following:

  • Advanced self-interference cancellation techniques for full-duplex
  • Advanced antenna and transceiver designs for full-duplex
  • Full-duplex reconfigurable intelligent (meta)surfaces
  • Full-duplex techniques with wireless power and energy harvesting
  • Full-duplex for simultaneous communication and sensing
  • Full-duplex millimeter-wave/THz systems
  • Multiple input multiple output full-duplex transceiver design
  • Performance analysis of full-duplex transceivers, systems, and networks
  • Physical layer security and full-duplex techniques
  • Resource allocation and user scheduling in full-duplex networks
  • Stochastic geometry for full-duplex systems
  • Experimental evaluation of full-duplex transceivers and networks

Submission Guidelines

Manuscripts should be submitted online at www.mdpi.com by registering and logging in to this website. Please visit the Instructions for Authors page before submitting a manuscript.

The timetable is as follows:

  • Manuscript Submission Deadline: November 30, 2021
  • Publication Date: Second Quarter 2022

Guest Editors:

Besma Smida, University of Illinois at Chicago, Chicago, IL, USA, smida@uic.edu;

George C. Alexandropoulos, National and Kapodistrian University of Athens, Athens, Greece, alexandg@di.uoa.gr